Shenzhen R&D Center, VIA Technologies
This project is located at the High-Tech Industrial Park in Shenzhen’s Nanshan District. Bounded by Shennan Avenue on the South and overlooking Shenzhen University, the new VIA Technologies R&D Center is a gateway landmark that visually integrates two traditionally disparate entities – industry and academia.
Shennan Avenue is Shenzhen’s main thoroughfare. Along its two sides formally extravagant office towers compete for attention. This project, however, embarks upon the design strategy of “less is more”, and employs the character “V” in VIA Technologies’ logo to generate an oblique expression in elevation. Through this simple, contemporary and delicate approach, a sense of richness and complexity is created.
At the lower levels a four-story tall plinth sits adjacent to the adjoining 30 meter-wide greenbelt. This immediacy enables a dynamic interaction among the user, the building and nature. From the fifth story onward, floor plates of the above 30 story tall tower reduce to create a slender profile and to minimize a sense of visual oppression inherent to a large building. A glass curtain wall wraps the tower, at once further lessening the tower’s physical presence and opening each of the floors to a panoramic view of Shenzhen. When viewed from the city, the glass becomes an expansive canvas, reflecting the light as it changes from dawn to dusk. This continual exchange among people, architecture and nature animates the building and becomes an unending source of inspiration to its user.
Location: Nanshan district, China
Structural system: Frame Structure
Building coverage: 6,000㎡
Total floor area: 63,160㎡
Design period: 2008.01 ~ 2010.08
Const. period: 2010.10 ~ 2013.06